Mfg. interconnected stacked multilayer plates - comprises forming insulating layers between conducting boards and hardening lacquer filling

摘要

Multilayer conductors are formed with a frame structure into which a wholly metallised resistive layer and a primary metal layer are passed. The layers are then removed all at once. Intermediate spaces between the layered conductors are then filled with a solvent-free lacquer so that isolating layers are formed. Pref. lacquer is based on epoxy resin or polybenzocyclo butene. USE/ADVANTAGE - Thick and thin film, hybrid module. Suitable as logic computers unit. High density packing of large scale integrated circuit components.