发明名称 |
Method of manufacturing a leadframe having conductive elements preformed with solder bumps |
摘要 |
Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at least one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.
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申请公布号 |
US5066614(A) |
申请公布日期 |
1991.11.19 |
申请号 |
US19900589816 |
申请日期 |
1990.09.28 |
申请人 |
HONEYWELL INC. |
发明人 |
DUNAWAY, THOMAS J.;SPIELBERGER, RICHARD K.;DICKS, LORI A.;LOY, JERALD M. |
分类号 |
B23K35/26;H01L23/488 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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