| 发明名称 |
DIRECT MOUNT SEMICONDUCTOR PACKAGE |
| 摘要 |
<p>A semiconductor package structure allows testing and includes a fuse link (19) to indicate a short circuit in a semiconductor device (14) before it is incorporated into a circuit. The package structure allows mounting a semiconductor device (14) entire within an opening in a printed circuit board (25) and permits stacking of printed circuit board in a minimum thickness configuration.</p> |
| 申请公布号 |
EP0413542(A3) |
申请公布日期 |
1991.12.04 |
| 申请号 |
EP19900308888 |
申请日期 |
1990.08.13 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
CHIU, ANTHONY;TEST, HOWARD |
| 分类号 |
H05K1/11;G01R31/28;H01L21/60;H01L21/66;H01L23/495;H01L23/58;H01L25/10;H05K1/18;(IPC1-7):H01L23/498 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
