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发明名称
RESIN COMPOSITION FOR SEALING AND SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH0472323(A)
申请公布日期
1992.03.06
申请号
JP19900184627
申请日期
1990.07.12
申请人
TOSHIBA CHEM CORP
发明人
SAWAI KAZUHIRO
分类号
C08L63/00;C08G59/00;C08G59/40;C08G59/62;H01L23/29;H01L23/31
主分类号
C08L63/00
代理机构
代理人
主权项
地址
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