发明名称 PRINTED CIRCUIT BOARD MANUFACTURING METHOD ACCOMMODATES WAVE SOLDERING AND PRESS FITTING OF COMPONENTS
摘要 <p>A first set of plated-through holes (12) in the printed circuit board (PCB) are covered by a protective solder mask (26) on the solder side of the PCB while a second set of plated-through holes (20) are exposed. Electrical components (22) are disposed on the component side with leads inserted in the second set of holes (20). Solder is prevented from flowing into the first set of holes (12) during wave soldering by the mask covering (26). Conductive pins (30) designed for press fitting into the first set of holes (12) are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.</p>
申请公布号 WO1992004812(A1) 申请公布日期 1992.03.19
申请号 US1991006416 申请日期 1991.09.04
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