发明名称 |
AUSSENLEITER-FORMUNGSVORRICHTUNG FUER HALBLEITERVORRICHTUNGEN |
摘要 |
<p>An exterior lead forming device for semiconductor devices includes a pair of roller holders rotatably attached to a punch plate. When the punch plate is lowered, the leads of a semiconductor device fixedly held on a bending die by a pressing plate are bent along the sides of the bending die. The paths of the bending rollers are monitored by a camera and path errors, calculated by a comparator, are fed back to a motor control circuit to adjust the positions of bending roller guide plates and thereby correct the path errors.</p> |
申请公布号 |
DE4128944(A1) |
申请公布日期 |
1992.03.26 |
申请号 |
DE19914128944 |
申请日期 |
1991.08.30 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
ISHIHARA, KAORU, FUKUOKA, JP |
分类号 |
H01L23/50;H05K13/00;H05K13/08 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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