| 摘要 |
A multi port apparatus (220,440) provides for the treatment of material. Such apparatus comprises at least one wafer (240,320,410), each wafer comprising a central area (246,325,416) providing a plurality of members (18,303,309,360) arranged in a plurality of layers (262,306,308,432) first peripheral support means (241,321,411) encompassing the central area and having upper and lower surfaces (244,245,324,414,415); second peripheral support means (248,326,418), having upper and lower surfaces (251,252,330,421,422) and carried radially outwardly from the first peripheral support means; and a plurality of separate bore fluid chambers (253-256, 335-338, 423-426) defined between the first and second peripheral support means and communicable with the central area; vessel means (228,448) providing a first port (221,441) a second port (222,442) and a plurality of separate bore fluid port means (223-226, 443-446) communicating with the four separate bore fluid chambers; and means for compressing (234,454) at least one wafer within the apparatus. The present invention also provides three and four port apparatus (60,180). Multi-chambered wafers (240,320,410) are provided as well as wafers (200,280,300,350 and 460) for use in the multi port apparatus. Finally, methods for the manufacture of wafers are provided.
|
