发明名称 |
CUTTING DEVICE FOR BRITTLE MATERIAL, CUTTING METHOD FOR BRITTLE MATERIAL, AND MANUFACTURING METHOD FOR CUT BRITTLE MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device for brittle material and a cutting method for brittle material that can achieve full-body cutting not through a fold breaking process without stopping conveyance even when a material is thick.SOLUTION: According to the present invention, there is provided a cutting device 1 for a brittle material 2 comprising: a conveyance mechanism 20 for conveying the brittle material 2; an infrared-ray line heater 10 for irradiating a region that the brittle material 2 conveyed by the conveyance mechanism 20 passes through with concentrated infrared rays linearly in a direction Y perpendicular to a conveyance direction X of the brittle material 2; and a heater moving mechanism 30 for moving the infrared-ray line heater 10 in the same direction and at the same speed with the conveyance of the brittle material 2 by the conveyance mechanism 20.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016210653(A) |
申请公布日期 |
2016.12.15 |
申请号 |
JP20150096378 |
申请日期 |
2015.05.11 |
申请人 |
CENTRAL GLASS CO LTD |
发明人 |
TAMON HIROYUKI;OTA HIDEAKI |
分类号 |
C03B33/09;B28D5/00 |
主分类号 |
C03B33/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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