| 摘要 |
PURPOSE:To provide a multilayered printed circuit board for a variety of electronic devices, in which the adhesion between circuit conductor layers and inner insulating layers is improved, and the insulating property of inner insulating layers is improved. CONSTITUTION:A multilayered printed circuit board includes an insulating board 6, at least one surface of which are provided with first wiring conductor layers 7, and an insulating resin layer 8 is provided over the first conductor layers 7. The insulating resin layer is provided with fine holes through 9 which the first wiring conductor layers 7 are connected with second wiring conductor layers 10 on the surface of the board. The resin layer 8 is composed of two parts 8a and 8b that show good adhesion to the conductor layers 7 and 10. Therefore, the multilayered printed circuit board has reliability of inner insulating layers. |
