| 摘要 |
PURPOSE:To provide a solid electrolytic capacitor which can be applied to various electronic apparatuses, can withstand a thermal shock applied to the capacitor especially at the time of surface mounting and, further, has excellent solderability and high reliability. CONSTITUTION:A capacitor element 21 and parts of a lead frame 22 are covered with molding resin to form a solid electrolytic capacitor. Solder alloy layers or tin metal layers having copper metal layers as foundation layers are formed on the surfaces of the parts of the lead frame 22 which are not brought into contact with the molding resin and only the copper metal layers are formed on the surfaces of the lead frame 22 which are brought into contact with the molding resin and, further, the surface is roughed. |
