发明名称 Endothermic cooler for electronic components
摘要 An endothermic cooler (10) for electronic components (16) in, for example, a missile (12) includes an enclosure (14) having a thermally conductive coupling to the electronic component. A source of water in a first compartment (28) is segregated from salts in a second compartment (30). The salts are capable of providing an endothermic reaction when mixed in a water solution. The two compartments are segregated from one another by a membrane or conduit (32). The membrane is pierced by a spike (34-2 or 34-3) through an actuating mechanism (36) and the conduit is opened by a valve (34-4). Formation of the solution provides cooling for conduction of heat from the electronic component through a thermally conductive plate (24) and its fins (26).
申请公布号 US5184470(A) 申请公布日期 1993.02.09
申请号 US19910793887 申请日期 1991.11.18
申请人 HUGHES AIRCRAFT COMPANY 发明人 MOSER, THOMAS P.;ROSSER, ROBIN W.
分类号 F25D5/00;H05K7/20 主分类号 F25D5/00
代理机构 代理人
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