发明名称 Printed circuit substrate configuration and structure.
摘要 <p>The structure can be used with single or double-sided printed circuit boards (1) and comprises a centralized land (3) disposed on one side of the substrate, and a power source output terminal (3) and circuit terminals (5-7, 41) to be connected with the power source output terminal connected on the centralized land (2). The substrate reliability can be improved even for circuits submitted to under a high supply voltage and large currents, such as in a horizontal deflection output circuit. Also the line pattern can be reduced in usual applications, thereby minimizing heat generation and improving the reliability. &lt;IMAGE&gt;</p>
申请公布号 EP0530096(A1) 申请公布日期 1993.03.03
申请号 EP19920402337 申请日期 1992.08.25
申请人 SONY CORPORATION 发明人 SAHARA, HIROSHI;KUSANO, SUSUMU
分类号 H04N3/16;H05K1/02;H05K1/11;H05K1/18 主分类号 H04N3/16
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