发明名称 |
Printed circuit substrate configuration and structure. |
摘要 |
<p>The structure can be used with single or double-sided printed circuit boards (1) and comprises a centralized land (3) disposed on one side of the substrate, and a power source output terminal (3) and circuit terminals (5-7, 41) to be connected with the power source output terminal connected on the centralized land (2). The substrate reliability can be improved even for circuits submitted to under a high supply voltage and large currents, such as in a horizontal deflection output circuit. Also the line pattern can be reduced in usual applications, thereby minimizing heat generation and improving the reliability. <IMAGE></p> |
申请公布号 |
EP0530096(A1) |
申请公布日期 |
1993.03.03 |
申请号 |
EP19920402337 |
申请日期 |
1992.08.25 |
申请人 |
SONY CORPORATION |
发明人 |
SAHARA, HIROSHI;KUSANO, SUSUMU |
分类号 |
H04N3/16;H05K1/02;H05K1/11;H05K1/18 |
主分类号 |
H04N3/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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