| 摘要 |
A fixing card for high frequency testing includes an insulation substrate, a measuring circuit formed on the top of the insulating substrate, through-holes formed at the center portion of the insulating substrate, and a fixing ring attached to the underside of the insulating substrate for enclosing the through-holes of the substrate. Probes are fixed to the underside of the insulating substrate and extend through the through-holes to electrically connect with the measuring circuit. In this manner the measuring circuit is located a very short distance from a die sorter being measured, permitting the use of a high frequency band.
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