发明名称 STACKED CAPACITOR OF DRAM AND ITS MANUFACTURING METHOD
摘要 The capacitor having 1st conductive region (36) and 2nd conductive region (38) formed on substrate (31) consists of 1st polysilicon wall (54') contacting (36) and expanding perpendicular to (31); 2nd polysilicon layer contacting (54') and expanding parallel to (31); 4th layer (54) contacting the top of (54') and expanding parallel to (31); 2nd wall (53') contacting (38) and expanding perpendicular to (31); 1st layer (51) contacting (53') and expanding opposite to (52); 3rd layer contacting the top of (53') and expanding parallel to (51); insulation layer (45) formed under (51); supporting layers expanding parallel to (53); dielectric film (81) formed on (53',54',51-54); and 5th layer (90) formed on (54) contacting (81).
申请公布号 KR930007192(B1) 申请公布日期 1993.07.31
申请号 KR19900009726 申请日期 1990.06.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAEK, WON - SHIK;CHOE, KYU - HYON;BAE, DONG - JU
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L29/78 主分类号 H01L27/04
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