发明名称 |
STACKED CAPACITOR OF DRAM AND ITS MANUFACTURING METHOD |
摘要 |
The capacitor having 1st conductive region (36) and 2nd conductive region (38) formed on substrate (31) consists of 1st polysilicon wall (54') contacting (36) and expanding perpendicular to (31); 2nd polysilicon layer contacting (54') and expanding parallel to (31); 4th layer (54) contacting the top of (54') and expanding parallel to (31); 2nd wall (53') contacting (38) and expanding perpendicular to (31); 1st layer (51) contacting (53') and expanding opposite to (52); 3rd layer contacting the top of (53') and expanding parallel to (51); insulation layer (45) formed under (51); supporting layers expanding parallel to (53); dielectric film (81) formed on (53',54',51-54); and 5th layer (90) formed on (54) contacting (81).
|
申请公布号 |
KR930007192(B1) |
申请公布日期 |
1993.07.31 |
申请号 |
KR19900009726 |
申请日期 |
1990.06.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAEK, WON - SHIK;CHOE, KYU - HYON;BAE, DONG - JU |
分类号 |
H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L29/78 |
主分类号 |
H01L27/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|