Curable resins, solutions thereof, processes for making them, and electronic part protective coatings.

摘要

A novel curable resin of structural formula (1) is provided wherein R<1> and R<2> are independently substituted or unsubstituted monovalent C1-10 hydrocarbon groups, R<3> is a divalent C1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is O or NH, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with an isocyanatosilane. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300 DEG C into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence. <CHEM> v