| 发明名称 |
METHOD FOR ROTARY-SAWING BRITTLE AND HARD MATERIAL, ESPECIALLY SAID MATERIAL HAVING DIAMTER EXCEEDING 200 MM, TO THIN WAFER BY USING RING-SHAPE SAW AND APPARATUS FOR EXECUTION OF SIAD METHOD |
| 摘要 |
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| 申请公布号 |
JPH05217971(A) |
申请公布日期 |
1993.08.27 |
| 申请号 |
JP19920210654 |
申请日期 |
1992.07.16 |
| 申请人 |
WACKER CHEMITRONIC GES ELEKTON GRUNDSTOFFE MBH |
发明人 |
KAARUHAINTSU RANGUSUDORUFU |
| 分类号 |
H01L21/304;B28D1/00;B28D1/22;B28D5/02;B28D5/04 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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