| 摘要 |
<p>A structure for attaching a heat sink to an electronic package comprising a pin (10) having a compressible point (16), the point being adapted to pass through aligned holes in a heat sink (40) and a printed circuit board (60) so that the point compresses as it passes into two holes and flexes back to an expanded position after it exits the printed circuit board hole opposite the heat sink thereby holding the heat sink to the board with the electronic package (50) therebetween.</p> |
