发明名称 Lead frame having an anodic oxide film coating
摘要 Lead frames, in which at least one part of the surface of a metal member which is a part of the lead frame is provided with an anodic oxide film of copper or a copper alloy, and in which a member composed substantially of a resin film or a resin plate is connected to the lead frame through this anodic oxide film by gluing or pressing under heat exhibit good adhesion between the metal member and the resin film or plate. Similarly, lead frames constructed with at least two metal members, having a portion of the surface provided with an anodic oxide film of copper or a copper alloy, and in which these metal members are joined together through this anodic oxide film exhibit good adhesion between the metal members.
申请公布号 US5252855(A) 申请公布日期 1993.10.12
申请号 US19910775549 申请日期 1991.10.15
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OGAWA, YOSHIAKI;NOGUCHI, HIROYUKI
分类号 H01L23/50;H01L23/495;H05K3/20;H05K3/38;(IPC1-7):H01L23/48;H01L29/44;H01L39/02;H01L29/46 主分类号 H01L23/50
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