发明名称 PREPREG UND DESSEN KOMPOSIT.
摘要 <p>This composite material comprises an epoxy resin, cured with dicyandiamide and/or a urea deriv. and reinforcing fibres. Finely dispersed in the epoxy resin are polyvinyl formal particles having an ave. size of not more than 5 microns. The reinforcing fibres are e.g. carbon fibres, aromatic gp. polyamide fibres, glass fibres etc. The prepreg is produced by blending a specified resin composite with reinforcing fibres using hot rolling etc. An example of a specified resin composite is one obtd. by melt mixing an epoxy resin composite (1) (100 pts. by wt.), polyvinyl formal resin (2) (1-30 pts. by wt.), and the curing agent dicyandiamide and/or urea derivs. The epoxy resin composite (1) comprises a bisphenol type epoxy resin having a mean mol. number of 400 or more (10-40 pts. by wt.), and a phenolnoborac (or its deriv.) epoxy resin (20-45 pts. by wt.). The polyvinylformal resin contains 60% or more vinyl formal, vinyl acetate and vinyl alcohol. Its mean deg. of polymerisation must be 100 or less.</p>
申请公布号 DE3785107(T2) 申请公布日期 1993.10.14
申请号 DE19873785107T 申请日期 1987.01.19
申请人 TORAY INDUSTRIES, INC., TOKIO/TOKYO, JP 发明人 SEIYA, YUJI, SHIGA 520, JP;ODAWARA, HIROYUKI, SHIGA 524, JP
分类号 C08G59/40;C08J5/24;C08L63/00;(IPC1-7):C08J5/24;C08G59/00;C08F299/02;C08G59/72 主分类号 C08G59/40
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