| 发明名称 |
Methods and apparatus for maintaining electroless plating solutions. |
| 摘要 |
<p>Methods and apparatus for controlling plating rates of electroless plating solutions. The invention provides for continuous monitoring and replenishment of a one or more components of an electroless plating solution on a real time basis. The invention can be characterized in part by use of a quartz crystal microbalance.</p> |
| 申请公布号 |
EP0564780(A1) |
申请公布日期 |
1993.10.13 |
| 申请号 |
EP19930102058 |
申请日期 |
1993.02.10 |
| 申请人 |
SHIPLEY COMPANY INC. |
发明人 |
STORJOHANN, DONALD E.;WIBERG, SVEN J. |
| 分类号 |
C23C18/31;C23C18/16;C23C18/34;H05K3/18 |
主分类号 |
C23C18/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
