发明名称 |
A photosensitive polyimide composition. |
摘要 |
<p>The present invention provides photosensitive compositions which comprise polyimide precursors having a chemical structure selected from several specific chemical structures and/or specific amide bond density and are adjusted so that the film obtained by applying and drying the composition may exhibit a specific absorbance to light. The polyimide film obtained by heat-curing the above photosensitive composition exhibits excellent physical properties and water resistance, and has high adhesive strength to epoxy resins, inorganic materials and metals.</p> |
申请公布号 |
EP0580108(A2) |
申请公布日期 |
1994.01.26 |
申请号 |
EP19930111557 |
申请日期 |
1993.07.19 |
申请人 |
ASAHI KASEI KOGYO KABUSHIKI KAISHA |
发明人 |
MATSUOKA, YOSHIO;YOKOTA, KANICHI;KATAOKA, YASUHIRO |
分类号 |
G03F7/038;H05K1/00;H05K1/03;(IPC1-7):G03F7/038;G03F7/037 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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