| 摘要 |
The present invention is a double-headed workpiece grinding method that supports a thin plate-shaped workpiece from the outside in the radial direction using a ring-shaped holder and rotates same and is for simultaneously grinding both surfaces of the ring-shaped holder-supported workpiece using a pair of grindstones. The double-headed workpiece grinding method is characterized in that both surfaces of the workpiece are ground simultaneously, setting the grindstone abrasion losses per 1 µm of workpiece grinding allowance to be 0.10 µm to 0.33 µm. Provided thereby is a double-headed workpiece grinding method capable of reducing nanotopography formed in a previous step such as a slicing step without worsening flatness during the double-headed grinding step. |
