SUBSTRATE POLISHING APPARATUS

摘要

A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.

主权项

1. A substrate polishing apparatus comprising:
a support part on which at least one substrate is disposed; a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction; a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts; a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate; and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate, wherein the plurality of polishing units rotates and revolves along a predetermined trajectory.