| 摘要 |
<p>The invention relates to the mounting, on a flexible substrate (6), of miniature electronic components of the ''beam lead'' type. The subject of the invention is a mounting process consisting, after having soldered a first connection lead (2) of a component (1) to the substrate (6), in bending each of the other connection leads (3) of the relevant component (1) while they are being soldered by pressing the relevant connection lead (3) onto a metallised area (5) of the substrate (6) by means of a point (10) of a soldering tool whilst moving this point (10) closer to the body of the relevant component (1) before performing the actual soldering. By virtue of this mounting method, the ''beam lead'' electronic components are no longer laid down on the substrate with their connection leads extended but rather arched over these leads, which provides them with a freedom of movement enabling them to absorb mechanical stresses by being flattened, to a greater or lesser extent, onto the substrate. …<IMAGE>… </p> |
