Semiconductor device capable of laminating a plurality of wiring layers which are more than four layers

摘要

In a semiconductor device comprising a plurality of wiring layers which are laminated on a silicon substrate, at least one of the plurality of wiring layers comprises an insulator layer, circuit patterns formed on the insulator layer, and a plurality of rectangular dummy patterns formed on a vacant area of the insulator layer. The plurality of rectangular dummy patterns are arranged so that two adjacent ones of the plurality of rectangular dummy patterns are arranged zigzag along a one direction and that extended lines of a pair of short sides of each of the plurality of rectangular dummy patterns orthogonally cross a pair of long sides of an adjacent one that is adjacent to the each of the plurality of rectangular dummy patterns.