发明名称 Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing
摘要 A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.
申请公布号 US9508575(B2) 申请公布日期 2016.11.29
申请号 US201414198150 申请日期 2014.03.05
申请人 APPLIED MATERIALS, INC. 发明人 Chen Hui;Ko Sen-Hou
分类号 B08B1/04;B08B11/02;H01L21/67;H01L21/02;B08B1/00 主分类号 B08B1/04
代理机构 Patterson & Sheridan, LLP 代理人 Patterson & Sheridan, LLP
主权项 1. A particle cleaning module, comprising: a housing; a substrate holder disposed in the housing, the substrate holder configured to retain a substrate in a substantially vertical orientation, the substrate holder rotatable on a first axis; a first pad holder disposed in the housing, the first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis; a first actuator operable to move the first pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis; a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis; and a rotary arm assembly, comprising: a rotary arm coupled with the first pad holder and operable for sweeping the first pad holder across a surface of a substrate; anda lateral actuator mechanism for moving the rotary arm toward the substrate holder.
地址 Santa Clara CA US