| 摘要 |
PROBLEM TO BE SOLVED: To control the amount of solder without using a solder preform.SOLUTION: A soldering device includes a thread solder supply section 2 for supplying a thread solder 21 with predetermined amount to be drawn out and supply angle, a light beam torch 3 performing non-contact local heating, a moving section 4 for moving the heating position of the light beam torch 3, and a control section 5 for controlling the thread solder supply section 2 and moving section 4. The control section 5 has a supply control section 51 for supplying the thread solder 21 between an electrode pad 1001 on a printed board 100 and the electrode 1011 of a chip component 101, a cutting control section 52 for cutting the thread solder 21 by moving the heating position of the light beam torch 3 to the cutting position of the thread solder 21, and a fusion control section 53 for fusing the thread solder 21 by moving the heating position of the light beam torch 3 above the electrode pad 1001.SELECTED DRAWING: Figure 1 |
