| 摘要 |
This invention aims at providing a wafer washing apparatus and a washing method capable of completely terminating washed wafer surfaces with hydrogen to prevent contamination and spontaneous oxidation. A wafer washing apparatus, having a single washing tank for liquid washing and drying comprises means for producing active hydrogen seeds from a hydrogen-containing gas, and means for introducing an active gas containing the hydrogen active seed into the washing tank wherein dangling bonds of the wafer are terminated with hydrogen by spraying the active gas containing the active hydrogen seed. A wafer drying method of washing a wafer by a washing solution and then drying it comprises spraying a gas containing hydrogen active seed to the wafer surface during drying, and terminating dangling bonds on the wafer surface with hydrogen.
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