SEMICONDUCTOR DEVICE

摘要

This invention relates to a semiconductor device sealed by using a thermosetting resin composition containing a thermosetting resin (I component), a curing agent (II component), and the following (III) and (IV) components. This semiconductor device is provided with heat resistance and flame retardance at the time of IR reflow, and has drastically improved reliability. (III) is a metal hydroxide expressed by the following general formula (1): n(MaOb).cH2O, where M is a metal element, a, b and c are positive numbers, n is a positive integer, M may be the same or different in repetition of MaOb, and a and b may be the same or different. (IV) is a metal oxide expressed by the following general formula (2): n'(QdOe), where Q is a metal element selected from the Groups IVa, Va, VIa, VIIa, VIIIa, Ib and IIb, d and e are positive numbers, n' is a positive integer, Q may be the same or different in repetition of QdOe, and d and e may be the same or different.