发明名称 |
Semiconductor device and method of fabricating the same |
摘要 |
A semiconductor device comprises a first conductivity type semiconductor layer and a second conductivity type well region which is formed on the semiconductor layer. The well region includes a first semiconductor region of a first depth and a second semiconductor region of a second depth deeper than the first depth which is provided in the central portion of the first semiconductor region. The ratio of the first depth to the second depth is settled in a range from 0.85 to 0.95 in order to increase the breakdown voltage of the semiconductor device.
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申请公布号 |
US5408117(A) |
申请公布日期 |
1995.04.18 |
申请号 |
US19920953301 |
申请日期 |
1992.09.28 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
UENISHI, AKIO |
分类号 |
H01L21/331;H01L21/336;H01L29/06;H01L29/10;H01L29/78;(IPC1-7):H01L29/10;H01L29/34 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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