发明名称 Electronic component operating with surface acoustic waves
摘要 A SAW component having a mode conversion structure (10; 10') on the component substrate (1), in which the mode conversion structure (10; 10') for a substrate material having strong coupling of surface waves to bulk waves is constructed as an electrode finger structure (11; 11') with a geometric period adapted to the coupling and matching metallisation ratio. <IMAGE>
申请公布号 DE4333342(A1) 申请公布日期 1995.05.04
申请号 DE19934333342 申请日期 1993.09.29
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 REINDL, LEONHARD, DIPL.-PHYS., 83134 PRUTTING, DE;WAGNER, KARL, DR., 81479 MUENCHEN, DE
分类号 H03H9/02;(IPC1-7):H03H9/145 主分类号 H03H9/02
代理机构 代理人
主权项
地址