| 摘要 |
A method of compliantly mounting piezoelectric device with a substrate (102). First, outer portions (114, 116) of a piezoelectric element (106) are selectively metallized. Next, one layer of aluminum (138) is selectively dispensed on the piezoelectric element. Third, an uncured conductive compliant material (112, 112') is placed and aligned on a substrate (102). Fourth, the piezoelectric element (106) is placed and aligned on the conductive compliant material, such that upon curing the conductive compliant material forms a compliant mount connecting the outer metallized portions (114, 116) of the piezoelectric element (106) with the substrate (102). |
