发明名称 Method and apparatus for checking the condition of adhesive application in packages
摘要 Method and apparatus for checking the condition of adhesive application in the form of beads on packages, characterized by the steps of causing each package to pass through a light reception area of an infrared sensor so as to receive infrared energy radiating from the beads on the package, detecting a signal output by the sensor in response to the received energy so as to measure at least one of a peak value corresponding to the rise of the received energy, a peak value corresponding to the fall thereof, and a period of time from the rise to the fall; and comparing an obtained value with a reference value so as to determine the condition of the beads.
申请公布号 US5444248(A) 申请公布日期 1995.08.22
申请号 US19940205970 申请日期 1994.03.03
申请人 OPTEX CO., LTD. 发明人 ICHIEN, KENJI
分类号 B65B51/10;G01N21/89;(IPC1-7):G01J5/10;G01N25/72 主分类号 B65B51/10
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