EPOXY MOLDING COMPOUND, PREPARATION AND USE THEREOF

摘要

An epoxy molding compound, preparation and use thereof are provided. The epoxy molding compound comprises an epoxy resin, a phenolic resin, a curing accelerator, a specific crystalline silica optionally in combination with a specific spherical silica, and one or more additives selected from the group consisting of a flame retardant, a wax, a coupling agent, a pigment, an ion trapping agent and a stress absorbing agent. The epoxy molding compound has a high thermal conductivity and a low wire sweep while maintaining other desired properties as required in the full-molded modules.