发明名称 |
SEMICONDUCTOR WAFER POLISHING APPARATUS AND METHOD |
摘要 |
<p>An apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus (56) within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher (58) within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism (62) is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.</p> |
申请公布号 |
WO9531309(A1) |
申请公布日期 |
1995.11.23 |
申请号 |
WO1995US04777 |
申请日期 |
1995.04.19 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
HILEMAN, HAROLD, J.;WALSH, ROBERT, J.;WALSH, THOMAS, A. |
分类号 |
B24B37/04;H01L21/00;H01L21/304;H01L21/687;(IPC1-7):B24B1/00;B24B7/22;B24B49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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