发明名称 Device and method for producing embossed cover elements for packaging
摘要 Device for producing embossed cover elements for emballages, which cover elements are embossed in and die-cut from a pseudo-endless sheet material which runs through the device in a longitudinal direction at temporary standstill of the sheet material, the device comprising at least one M (M‰¥1) die-cutting tools and M x N (N‰¥2) embossing tools, wherein N different embossing tools are combined with each die-cutting tool in the longitudinal direction.
申请公布号 PL2857187(T3) 申请公布日期 2016.09.30
申请号 PL14183225T 申请日期 2014.09.02
申请人 发明人 MIKAC NEMANJA
分类号 B31D1/00;B31F1/07;B65B7/01;B65B41/18 主分类号 B31D1/00
代理机构 代理人
主权项
地址