PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed wiring board includes a core substrate, and a first build-up wiring layer formed on the core substrate and including a wiring layer such that the wiring layer includes a resin insulating layer and a conductor layer laminated on the resin insulating layer. The first build-up wiring layer is formed on a first surface of the core substrate such that the first build-up wiring layer forms a high-rise region and a low-rise region with respect to a lamination direction, the first build-up wiring layer includes electrodes positioned to connect an electronic component to the first build-up wiring layer, and the first build-up wiring layer is formed such that the low-rise region is extending in two or more directions from the high-rise region to edges of the core substrate.

主权项

1. A printed wiring board, comprising:
a core substrate; and a first build-up wiring layer formed on the core substrate and comprising a wiring layer such that the wiring layer comprises a resin insulating layer and a conductor layer laminated on the resin insulating layer, wherein the first build-up wiring layer is formed on a first surface of the core substrate such that the first build-up wiring layer forms a high-rise region and a low-rise 10 region with respect to a lamination direction, the first build-up wiring layer comprises a plurality of electrodes positioned to connect an electronic component to the first build-up wiring layer, and the first build-up wiring layer is formed such that the low-rise region is extending in at least two directions from the high-rise region to edges of the core substrate.