发明名称 Hot press for use in production of multilayered substrate
摘要 A hot press for producing a multilayered substrate including vertically opposing upper and lower bolsters relatively movable toward each other to press multilayered substrate blanks and to cool the plates after the bonding. A sealing arrangement includes a cylinder and encloses the upper and lower bolsters so as to define a hermetically sealed space, with an evacuating arrangement reducing the pressure inside the hermetically sealed space during heating and pressing in which a bonding agent in the multilayered substrate blanks is softened. A high-pressure gas supplying arrangement supplies a pressurizing gas into the hermetically sealed space so as to impart the bonding pressure. A pressure sensor detects the pressure inside the hermetically sealed space, and a controller effects a compensation for incremental increases in the bonding pressure when the pressure inside the hermetically sealed space is reduced by the evacuating arrangement and for incrementally decreasing the bonding pressure when the pressure inside the space is elevated by the pressurized gas, by feedback output signals of the pressure sensor to the hydraulic pressure source.
申请公布号 US5496433(A) 申请公布日期 1996.03.05
申请号 US19930038293 申请日期 1993.03.29
申请人 HITACHI TECHNO ENGINEERING CO., LTD. 发明人 MIYASHITA, AKIMI;FUJII, MUTSUMASA;KOGAWA, KIYONORI;KYOUI, MASAYUKI
分类号 B29C43/20;B29C43/32;B29C43/36;B29C43/56;B29C43/58;B29C65/52;B29K105/06;B29L9/00;B29L31/34;B30B7/02;B30B12/00;B30B15/06;B30B15/22;B30B15/34;H05K3/46;(IPC1-7):B29C43/58 主分类号 B29C43/20
代理机构 代理人
主权项
地址