| 摘要 |
PURPOSE: To relieve thermal stress in a mounting structure for a connecting portion and so forth between electronic parts and circuit substrate by restricting a sudden temperature change during operation, no-operation or the like of electronic parts. CONSTITUTION: A plate-shaped heat accumulating member 2 having a through- hole 2a at the center is arranged on the top surface of an LSI 3 mounted on a circuit substrate 4 through a connecting portion 6 such as BGA, moreover, on the top surface of said member 2, a heat sink 1 comprising heat radiating fins only for heat radiating effect having the same shape as the through-hole 2a of the heat accumulating member 2 or a smaller projected portions 1a on the bottom surface is arranged, and the heat accumulating member 2 and LSI 3 as well as the heat sink 1 for heat radiating effect and the LSI 3 are respectively contacted with each other in this heat radiating construction. Part of heat released from the LSI 3 in operation is stored in the heat accumulating member 2 and, if the temperature of LSI 3 drops due to the stop of operation, then heat is given from the heat accumulating member 2 and a sudden temperature drop in the LSI 3 can be restricted. |
