首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SEMICONDUCTOR ABRADING DEVICE
摘要
申请公布号
JPH08172118(A)
申请公布日期
1996.07.02
申请号
JP19940316127
申请日期
1994.12.20
申请人
HITACHI LTD
发明人
TSUNODA KAZUHIRO
分类号
H01L21/66;H01L21/304;(IPC1-7):H01L21/66
主分类号
H01L21/66
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ALLOYING COMPOSITION
POLYMER-CONCRETE MIX
GLUE COMPOSITION FOR CEMENTING FOOTWEAR PARTS
POLISHING AGENT
PROCESS FOR PRODUCING LIGHT-CONDUCTING OR LIGHT-INSULATING DUCTS IN GLASS
INSTALLATION FOR CLEANING EFFLUENT AFTER WASHING OF MACHINES AND COMPONENTS
HEAT-SHRINKING OVEN
DAMPING MEMBER OF A VEHICLE STEERING WHEEL
ROAD TRAIN COUPLING AND TOWING ARRANGEMENT
FUSED MAGNESIA PRODUCTION METHOD
6-METHYLPHENANTRIDINE SALTS AS SENSITIZERS OF ELECTROPHOTOGRAPHIC LAYERS BASED ON CARBAZOLE DERIVATIVES
UNIT FOR MAKING FOOTWEAR SOLES
ARRANGEMENT FOR SEPARATING A FIBROUS BOARD FROM TRAY
AUTOMATIC OPERATOR
METHOD OF ELECTROCHEMICAL MACHINING OF HOLES
STAND FOR ASSEMBLING ARTICLES FOR WELDING
ARRANGEMENT FOR SECURING AND CLAMPING PARTS
METHOD OF MILLING THE BODIES OF ROTATION
WICKET TAPER REFRACTORY GATE
EXOTHERMAL MIX FOR INGOT SINKHEAD
