| 摘要 |
PURPOSE: To provide an IC carrier mechanism, in which deformation of an IC lead is prevented. CONSTITUTION: In a first position for feeding an IC 1, since a guide 4 is lowered, the IC 1 is seated in a rectangular base 4A without its lead 1A coming into contact with the inclined surface 41 of the guide 4. Since the guide 4 is slowly raised following a slope 6A while a stage 3 is moved to a second position for housing the IC 1, the lead 1A of the IC 1 is placed along the inclined surface 41 of the guide 4 without any impacts applied thereon and the posture of the IC 1 is corrected. |
