| 摘要 |
<p>A die bonding apparatus for bonding a semiconductor die onto a boding surface of a semiconductor lead frame by pressing the semiconductor die under a constant pressure. The apparatus includes a mounting section for mounting the semiconductor die a collet having chucking portion for holding the semiconductor die mounted on the die mounting section, a linear motor for moving the collet up and down, a separating member for separating the semiconductor die from the die mounting section, a horizontal driving section for moving the collet horizontally, a lead frame mounting section for mounting the semiconductor lead frame, a position sensor for detecting vertical positions of the collet and a linear motor control section for controlling vertical travel speed of the collet and bonding pressure of the die against the bonding surface of the semiconductor lead frame, by controllably driving the linear motor on the basis of position information of the collet detected by the position sensor.</p> |
