发明名称 Component to cooling body thermal coupling appts. for integrated electronic component
摘要 The planes of thermally contacted surfaces deviate from parallelity and rated spacing. There are two complementary, free play containing, meandering, interengageable heat transfer sections (2,3), one being (2) rigidly secured to a cooling body (1). The other section (3) is spring-loaded against the component (4) surface. Pref. the sum of the opposite surface parts of the heat transfer sections is greater for each transfer section than the thermally contacted surface of the component.
申请公布号 DE19520938(A1) 申请公布日期 1996.12.05
申请号 DE1995120938 申请日期 1995.06.02
申请人 MANNESMANN AG, 40213 DUESSELDORF, DE 发明人 HERRES, KARL, DIPL.-ING., 31675 BUECKEBURG, DE
分类号 H01L23/433;(IPC1-7):H05K7/20;H01L23/34 主分类号 H01L23/433
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