| 发明名称 |
Method and apparatus for packaging a chip |
| 摘要 |
A body (2700) having a cavity (2710) for mounting a substrate (2790) fabricated with probe sequences (2795) at known locations according to the methods disclosed in United States Patent Number 5,153,854 and PCT WO 92/10092, for example, is provided. The cavity (2710) includes inlets (2750 and 2751) for introducing selected fluids into the cavity (2710) to contact the probes (2795). Accordingly, a commercially feasible device (2700) for use in high throughput assay systems is provided. <IMAGE> <IMAGE> |
| 申请公布号 |
EP0695941(A3) |
申请公布日期 |
1996.12.27 |
| 申请号 |
EP19950303356 |
申请日期 |
1995.05.19 |
| 申请人 |
AFFYMAX TECHNOLOGIES N.V. |
发明人 |
BESEMER, DONALD M.;GOSS, VIRGINIA W.;WINKLER, JAMES L. |
| 分类号 |
G01N33/543;B01F13/00;B01F13/02;B01F13/08;B01J19/00;B01L3/00;B01L9/00;B81B1/00;C07H21/00;C12M1/00;C12M1/34;C12N15/09;C12Q1/68;C40B40/06;C40B40/10;C40B40/12;C40B60/14;C40B70/00;G01N21/03;G01N21/78;G01N33/53;G01N35/00;G01N37/00;(IPC1-7):G01N33/543 |
主分类号 |
G01N33/543 |
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