发明名称 Fluid Cooled Server and Radiator
摘要 A fluid cooled server may include a reservoir for a cooling fluid, a pump for circulating the cooling fluid between components within the server, one or more tubes for transporting the cooling fluid to a water block adjacent to a component to remove heat from the component. The cooling fluid may be transported from an outlet of the water block to an inlet of a radiator for progressively removing heat from the cooling fluid. The fluid may then be transported from an outlet of the radiator to an inlet of the reservoir. In some instances, the radiator may be sized to be included within a 1U server chassis and may include two or more cooling channels and may be dimensioned such that the radiator may have a heat exchange capacity of between about 300W to about 550W. A fan module may be sized to blow air through the radiator and/or the server chassis.
申请公布号 US2016345469(A1) 申请公布日期 2016.11.24
申请号 US201615161948 申请日期 2016.05.23
申请人 Teza Technologies LLC 发明人 Begolli Vegim;Yuque Wilbert
分类号 H05K7/20;F04D29/38;F04D29/28;F04D17/16;F04D19/00 主分类号 H05K7/20
代理机构 代理人
主权项 1. A radiator for a computer server comprising: an inlet; four or more fluid channels, wherein each of the four or more fluid channels are fluidly connected in series to provide progressive cooling of fluid flowing within the four our more fluid channels; an outlet; and a reservoir.
地址 Chicago IL US
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