| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conduction sheet which does not damage a semiconductor element during fixing, realizes good contact between a heat sink body which is a heat dissipation material and a semiconductor element and brings about effective heat conduction and good heat dissipation effect. SOLUTION: The title heat conduction sheet is provided with a silicone gel layer 2 whose heat conductivity is 1×10<-3> to 5×10<-3> cal/cm.sec. deg.C and consistency is 10 to 80 in both sides of a supporter 1 whose heat conductivity is 1×10<-4> cal/cm.sec. deg.C or more.
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