| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique by which the high-density packaging operation of interconnections and the multilayer system of the interconnections can be realized simultaneously in a semiconductor integrated circuit device comprising a multilayer interconnection. SOLUTION: In a gate array comprising a six-layer interconnection, a second- layer interconnection 9 up to a fifth-layer interconnection 12 are used as signal interconnections. The second-layer interconnection 9 and the frouth-layer interconnection 11 are extended to the Y-direction at an interconnection pitch of 2.0μm, and they are arranged so as to be shifted by 1.0μm as a half distance of the interconnection pitch. In addition, the third-layer interconnection 10 and the fifth-layer interconnection 12 are extended into the X-direction at an interconnection pitch of 2.0μm, and they are arranged so as to be shifted by 1.0μm as a half distance of the interconnection pitch.
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