Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process

摘要

An improved semiconductor wafer carrier (16) holds semiconductor wafer (14) during a CMP process and achieves a more uniform layer of slurry (24) at greater polishing speeds. Carrier (16) directs slurry (24) between semiconductor wafer (14) and conditioning pad (22) and includes wafer holding surface (52) for holding semiconductor wafer (14) as semiconductor wafer (14) contacts conditioning pad (22) and slurry (24). Outer rim portion (56) surrounds semiconductor wafer holding surface (52). A plurality of slurry channels (58) associate with outer rim portion (56) for receiving slurry (24) and directing slurry (24) between semiconductor wafer (14) and conditioning pad (22) for maintaining a uniform layer of slurry (24) between semiconductor wafer (14) and conditioning pad (22).