发明名称 MANUFACTURE OF MULTILAYER BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer board manufacturing method capable of making a positioning precision of boards for internal layers excellent, even if the thickness of laminated substances becomes thick, and to provide a multilayer board hard to produce wrinkles on metal foil surfaces by forming multilayer boards using eyelet pins. SOLUTION: This is a multilayer board manufacturing method which manufactures a multilayer board by fixing a laminated substance 12 having prepregs 11 laminated on each upper surface and underside of a plurality of boards 10 for internal layers, with an eyelet pin 13 composed of a shaft 1 and a flange 5 provided on one end part of the shaft 1 and having a through hole 4 opened vertically, and arranging metal foils on the outermost layers after that and performing forming applying heat and pressure. The shaft 1 is composed of a thick cylinder 2 and a thin cylinder 3 having the same central axis as the thick cylinder 2, and the thick cylinder 2 is joined to the flange 5. The inside diameter of the thin cylinder 3 is equal to or larger than that of the thick cylinder 2, and the outside diameter of the thin cylinder 3 is equal to or smaller than that of the thick cylinder 2.
申请公布号 JPH0992973(A) 申请公布日期 1997.04.04
申请号 JP19950243328 申请日期 1995.09.21
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KITAGAWA SHUJI;HAMATSU TSUTOMU
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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