| 摘要 |
PROBLEM TO BE SOLVED: To prevent the inclination of a chip in flip-chip connection and to prolong the life of bump connection. SOLUTION: This connection structure has bump electrodes 17 which are arranged at a comparatively shorter distance from the center of a semiconductor chip than the chip size, and through the medium of bumps 11 formed on these electrodes the semiconductor chip is connected to a circuit board 4 electrically. On this occasion, four dummy bumps 9 which regulate the distance 10 between the flip chip 21 and the circuit board 4, does not have mechanical connection with either the flip chip or the circuit board, and does not have an electrical connection function between the flip chip and the circuit board. |
